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In the case of that technology, the IMC can be exceptionally thin immediately after soldering due to the short time of liquidus, but it is and must be present for soldering to occur High temperature, time, and intimate contact of the liquid solder enhance the rate and volume of intermetallic compound formation The IMC is a crystalline intermediate alloy phase composed of some or all of the contacting metal constituents This high-alloy concentration region generally has properties that are vastly different from those of either the solder or the contacted metals It is a brittle material that is electrically conducting or even semiconducting Solder is thought of as a soft, forgiving material of low melting-point and good electrical conductivity.

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It is ironic that the essence of soldering the actual bond, or more correctly, the bond s anchor (IMC) is in fact, a brittle, high melting-point composition of generally poor electrical conductivity 4457 Cooling and Phase Change to Solidus As the solder approaches its solidus temperature, the rate of intermetallic compound formation decreases significantly and the solder joint is formed It is critical that the solder freezes prior to circuit board handling for two important reasons First, accidental movement of the PWB may cause the components to move in the molten solder, which could result in defects such as solder joint opens (disbonds) or solder shorts (unwanted bridging of solder from one bond pad to the next) Second, a solder joint disturbance at the critical transition from liquid to solid may result in a bond of degraded reliability.

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This type of bond has an inherently grainy look and can even have microfractures within caused by motion-induced interruption of orderly crystal growth during solidification The cooling rate at the tail end of the process is as important as at the onset of heating Extreme cooling rates may result in component cracking or electrical performance degradation induced by differential contraction of materials..

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Numerous considerations are crucial for successful circuit board assembly and useful product life Assembly processes and materials that result in solder-joint formation can also have a profound effect on long-term solder-joint reliability as well as a product s environmental exposure and handling during its lifetime Design and assembly engineers need to take into consideration temperature extremes and thermal excursion ramps that the product may endure as well as anticipated mechanical shock and vibration, the number of power (on-off) cycles expected over its lifetime, exposure to airborne particulates, gaseous pollutants, humidity, and handling Such exposures may impact the printed circuit assembly (PCA) during soldering, when being handled on the factory floor, or while in the hands of the product s end user These are but a sampling of variables that influence product reliability and should be considered in defining design and assembly attributes.

a = Pa ho where is the viscosity of the gas, Pa the ambient pressure, a the radius of the shaft and ho is the radial clearance The load capacity of the aerodynamic journal bearing increases with increasing compressibility numbers as in Figure 770 The load capacity also depends on the length-to-diameter ratio of the bearing Long bearings are more efficient for load carrying than short bearings Hybrid bearings also have the advantage in the case of internal supply pressure failure Most hybrid bearings are capable of working on a pure hydrodynamic film For a thrust bearing, a Rayleigh step may be incorporated at the leading edge of each pad to combine the hydrodynamic capacity with an adequate land area for the action of hydrostatic pressure [35] This arrangement can be seen in Figure 771

PCA designs are most often driven by electronic device availability, electrical performance requirements, affordability, and the product s end-use environment and operating conditions This chapter will strictly avoid offering up generalized rules for all soldering process applications The materials and requisite solder-joint reliability properties for a desktop computer are markedly different from those for the ignition system printed circuitry associated with the engine of a motor vehicle Similarly, mobile electronics (mobile phones, laptop computers, PDAs, etc) have the added requirements of mechanical shock-resistance as well as high-volume manufacturing needs, including low cost, ease of assembly, and high yields In some cases, the cost to repair a PCA or an entire product may exceed the value of the combined material and labor content of the first-pass assembled product.

Now type any key; the 8515 will light up the ASCII code of the key on the eight LEDs and also increment the code and transmit it back So if you press A , it will send back B and so on..

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