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Heating to Liquidus Once heated to melting, solder begins to form a metallurgical bond with contacted metals if wettable by dissolution and alloy formation.After the process starts, it progresses slowly, causing the solder to spread as it dissolves surfaces and alloys with it. The molten solder is drawn by surface tension to fill fine capillaries, and surface tension causes the solder to flow across wettable surfaces to some extent, forming webs of solder known as fillets. The solder fillet acts as a mechanical gusset imparting strength to the resultant solder joint.

Solder Fillet Formation The solder fillet is an overt manifestation of surface tension and wetting. Fillets are readily apparent in Fig. 44.2, which shows the fillet as a web of solder extending from the PWB bonding pad to the lead of the component. Gull-wing leads rely on good heel fillets for solder joint strength. Toe fillets may be present or absent depending whether there is exposed copper or other oxidized or unsolderable exposed metal at the lead tip where the lead-frame was excised from its tooling strip. Toe fillets are of little importance, adding little strength to the soldered assembly. The bulk of the strength comes from the heel fillet and the solder wetted to the capillary between the bottom of the component lead and top of the bond pad. Similarly, side fillets may be present, but if the component lead width is on the order of the bond pad width, there may not be enough room to develop good side fillets. The wetting angle is also known as the dihedral angle. The lower the dihedral angle, the better the wetting. For an example of a PTH solder fillet, see Fig. 44.2. The fillet is a reasonable indicator of the degree of solder wetting and, therefore, of process goodness. It is generally believed that the higher solder fillet, the better the solder joint, but high fillets can be indicative of three problems: excessive overheating, which can result in brittle solder joints; excessive solder volume, and loss of component lead flexibility due to overly high fillet formation.

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A very popular RS-232 line driver and receiver that I have extensively used is MAX232 from Maxim, as well as the pin-compatible ADM232 from Analog Devices The circuit schematic for the RS-232 interface is illustrated in Figure 619, appearing later in this chapter The following piece of code shows how to set up the built-in serial port (called UART in the AVR datasheets) of the AVR processors The following program is also available on the CD in the code directory as file uartdrvasm The code is executed on the circuit illustrated in Figure 64 I have chosen to use the AT90S8515 for this exercise The 8515 is connected to the PC serial port through a MAX232 level translator chip On Windows or DOS, run any terminal emulation program and set the baud rate to 9600, 8 data bits, 1 stop bit, and no parity format.

FIGURE 44.2 Solder fillet formation: (a) Cross-section of an SMT solder joint; (b) a PTH solder joint in cross-section. In the case of the SMT solder joint, solder has wet to the pad and lead. The low wetting angles and good fillet formations are indications of good solder wetting. The PTH solder joint shows good fillet formation on the secondary side of the PWB. At the top, the primary side, the fillets are not as well formed, probably due to lower temperature at the top side of the board. (Courtesy of Hewlett-Packard.)

If too much solder wicks up the lead, it may cause solder shorting, particularly near the package body, where the lead spacing may be finest Therefore, fillet examination alone is not sufficient to accurately assess soldering process performance But, for a fixed set of process parameters, fillet appearance may provide a good means of first-pass comparative assessment of solderability and soldering results 4456 Intermetallic Compound Formation Intermetallic compound (IMC) formation is the key to soldering IMC is the local alloying created at the boundary of the solder liquidus and the surfaces of the metal with which it is in contact It is the essence of soldering There is much misinformation about IMCs One thing is certain: Without intermetallic formation, there is no solder joint This is stressed because some erroneously claim lack of IMC in such processes as laser soldering.

01 Simple orifices with circular pockets e = 05 For e = 09 multiply C L by 165 0 0 05 10 15 20 25 30

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